Manufacturing Operations Analysis Solution

    BoostBe+ is an advanced factory solution that produces products tailored to customer needs.
    It integrates IoT, AI, and big data to enable automation and digitization, going beyond traditional factory automation.
    BoostBe+ features objects related to manufacturing, such as procurement, logistics, and consumers.
    These objects are equipped with intelligence and linked via IoT to power seamless data connection, collection, and analysis for autonomous operations.

    YMS

    rSPC

    FDC/EPT

    RPT

    Field-oriented
    Optimized service

    What does it do?
    Yield Management System (YMS) leverages all data generated from the manufacturing process to identify potential root causes of issues, such as equipment or process inefficiencies, through structured and unstructured analysis.
    1.
    Data analysis: Analyzes data collected during production to detect anomalies and apply statistical methods to improve quality.

    2.

    Real-time monitoring: Monitors changes in process workflows in real-time, offering early warnings to address problems swiftly.

    3.

    Process improvement: Identifies optimal operating conditions by analyzing correlations between operational parameters and equipment, enhancing process efficiency.
    4.
    Data integration: Consolidates data from various sources to provide a comprehensive view of the environment.
    Detects anomalies and analyzes statistical data to improve the quality of manufacturing processes.

    Features early warning tools that monitor abnormal signs in real-time process flows. 

    Provides analytical functions that incorporate variability control and predictive process characteristics.

    Product Configuration

    Field-oriented
    Optimized service

    Detects anomalies and analyzes statistical data to improve the quality of manufacturing processes.

    Features early warning tools that monitor abnormal signs in real-time process flows.

    Provides analytical functions that incorporate variability control and predictive process characteristics.
    User-friendly
    • Open user interface
    • Field-oriented system that incorporates engineers' expertise
    Data integration
    • Comprehensive data integration system for manufacturing processes
    • Optimized data network
    Standardized analysis process
    • Consistent analysis quality without reliance on individual experience
    • Eliminates simple and repetitive tasks
    • Analytical capabilities enhanced using statistical techniques
    Knowledge-based workflows
    • Workflows that incorporate engineers' expertise
    Output
    • Raw Data Display
    • : Line, Eqpid, Time, Item , Subitem, value
    • Excel save
    • Lot Trace / Wafer Map link
    • Field / Raw / Column modify

    Chart

    M-P Operation

    Inspection Step
    Item
    Value
    Gate Particle
    CD01
    12
    CD02
    10
    Gate-DEV AOI
    Item1
    10
    Item2
    20
    Gate-DEV MAR
    Item2
    20

    Chart

    Real Time Warning

    Daily Summary

    • Summary of product generated results
    • Detail alarm data
    • Item , Step chart

    Monitoring

    MAP & Image

    MAP & Image

    EQP Contact

    Data Summary

    Raw data file

    • DC /EDS Raw data file
    • Search : LOTID Like
    • Output view & download

    Search & Batch

    • Search : Line / term / Process /  Partid
    • Data Area (FAB(P)/FAB(M)/DC(In-Line)/DC(Final) /EDS(BIN)/EDS(Measure)

    Result & Chart

    Search & Batch

    Result & Chart

    • FAB : Site map  , Item Range Bar Chart
    • Defect : Defect Class , Size Chart  ,  Defect Image
    • DC : Item Range Bar Chart
    • EDS : BIN, Measure map ,  BIN , Item Bar Chart
    • EDS Map Link : DC . FAB data
    • EDS Map Group analysis (AREA, Circle , Shot)

    Monitoring

    Bin/Measure Data Wafer/ Lot Trend

     Bin/Msr  Map

    Fail Bit Map

     Composite (EQPID)

    Measure  Chip Chart

    Zone Analysis

    Map Search
    LOT1
    Wafer2
    product
    70%
    2017-05-21
    LOT2
    Wafer1
    product
    70%
    2017-05-21
    MAP Link

    Lot Group

    Commonality

    Select  & Analysis

    Result & Chart

    PARTID
    LOTID
    STEP
    Wafer ID
    DESC
    YIELD
    S3PART
    KOLT.1
    150000
    #12,1,3,4,6,7,8
    NORMAL
    91.2
    #2,5,8, 11, 14, 17,20,23
    EIN (CP01 CH_B, P-chuck)
    90.2
    LOTID
    STEP
    ITEMID
    Normal
    EIN
    P. value
    LSL
    TARGET
    USL
    CntWF
    AVG
    STD
    CntWF
    AVG
    STD
    0853.1
    6150000
    CD1
    2
    2
    0.2
    2
    2
    0.2
    0.1
    1
    2
    3
    LOTID
    STEP
    SPLIT Group
    0_0
    1_PC
    2_BG
    53_Malbalgub
    K0853
    2A0076R6
    NORMAL
    2
    11
    3
    1
    EIN (CP801 CH_B, P-chuck)
    1
    2
    4

    Search & Batch

    EQP Commonality

    • EQP Progress
    • Time difference
    • EQP Path

    Significant difference

    • FAB (measure)
    • DC

    Result & Chart

    Search

    Chart & Output

    Product Support

    “Verified or Sustainable”
    More than 30 years of experience and over 100 factories
    UMS
    • Providing comprehensive software maintenance through the UMS Center, addressing defect fixes, performance enhancements, feature improvements, and product updates after deployment
    Operational Training
    • System administrator manual provided for smooth post-deployment operations
    • Product training for administrators
    • Dedicated Product Management Center to oversee operating systems and handle routine maintenance
    Product Support
    • Product updates
    • Online manuals and user guides
    • Online platform for sharing feedback and suggestions related to the product
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